Dr. Chai offers his accumulated over 20 years of experience in high-speed analog and mixed-signal circuit design, semiconductor devices and 3D electromagnetic RF components modelings for integrated-circuit (IC) design and for signal/power integrity analysis. He had worked at leading semiconductor IC design companies in USA such as Intel Corp., Teradyne Corp., and Lattice Semiconductor Corp. with a number of distinguished accomplishments: a number of IC design silicon tapeouts, 6 issued US patents and IP, and 6 technical and conference paper publications. Dr. Chai has recently found SIdoctor Technologies in California, an IC design consultant company, whose customers include Raytheon Corp.’s RF and Hardware Engineering Center in California USA, and Alphacore Inc.’s High-Speed IC Design in Arizona USA. Dr. Chai has earned his Ph.D. in Electrical Engineering from the University of Washington, Seattle ; and his M.S. in Electrical Engineering from UCLA, Los Angeles. He is also a senior member of IEEE ( Institute of Electrical and Electronics Engineers), and acted as the vice president of IEEE Buenaventura’s Electron Devices and Circuits and Systems Chapter in California.